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论文题目:
Joining of silicon nitride ceramic to oxygen-free copper using Ag-Cu-TiH2 filler
作者:
Tang, Liangliang; Yao, Dongxu; Xia, Yongfeng; Zhao, Jun; Zhu, Ming; Zeng, Yu-Ping
刊物名称:
JOURNAL OF THE AMERICAN CERAMIC SOCIETY
发表年度:
2024
卷:
107
期:
9
页码:
