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论文题目:
Chemical bonding engineering for high-symmetry Cu2S-based materials with high thermoelectric performance
作者:
Wang, Yajun; Long, Zhi; Cheng, Yao; Zhou, Min; Chen, Hongyi; Zhao, Kunpeng; Shi, Xun
刊物名称:
MATERIALS TODAY PHYSICS
发表年度:
2023
卷:
32
期:
页码:
