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论文题目:
Investigation of the glass forming regularity and thermal behavior of lead-free V2O5-TeO2-RO (R = Ca, Sr, Ba) low temperature sealing glass for electronics packaging
作者:
Ge, Wenjie; Ren, Haishen; Zhang, Yi; He, Fei; Jiang, Shaohu; Zhao, Xiangyu; Lin, Huixing
刊物名称:
JOURNAL OF ALLOYS AND COMPOUNDS
发表年度:
2023
卷:
971
期:
页码:
