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论文题目:
The preparation of SiCP/Ag-Cu-Ti hybrid tapes and application in the joining of silicon carbide ceramics
作者:
Liu, Yan; Tang, Mao; Lin, Tiesong; Wu, Xishi; Zhang, Hui
刊物名称:
JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY
发表年度:
2019
卷:
期:
页码:
