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论文题目:
Improved Reliability of Planar Power Interconnect With Ceramic-Based Structure
作者:
Zhang, H; Li, JF; Dai, JR; Corfield, M; Liu, XJ; Liu, Y; Huang, ZR; Johnson, CM
刊物名称:
IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS
发表年度:
2018
卷:
期:
页码:
